- miala tsiny, tsy azo vidiana ity vokatra ity.
Description
Product Name: Press Claw
Marika: China DOXO
Laharana fandeferana: +-0.002
Applicable equipment: Semiconductor aluminum wire bonding equipment
Processing customization: processing according to drawings
KEVITRA: SKD 11
Fampiharana: automotive electronics IGBT triode diode
Tombontsoa vokatra: mafy mafy, fitotoana avo, ela velona, and improved product yield
vokatra mifandraika
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Mold die head for die bonder ASM & KS used for automotive electronics and IGBT
Hamaky bebe kokoa -
High temperature rubber suction nozzle tips for die bonder ASM
Hamaky bebe kokoa -
Tungsten carbide thimble pin for die bonder ASM and KS
Hamaky bebe kokoa -
Stainless steel thimble stick for die bonder ASM and KS
Hamaky bebe kokoa
