As global demand for advanced electronics accelerates—from electric vehicles (EVs) to 5G and AI—wire bonding equipment has emerged as a critical component of semiconductor manufacturing. Once considered a mature technology, wire bonding is now evolving rapidly to meet the needs of high-performance, miniaturized devices and advanced packaging techniques. In this article, we examine the key … Soma zaidi
Amidst the rapid development of global technology and manufacturing, Tesla stands out like a brilliant star. With its exceptional innovation capabilities and leading technological prowess, it has ignited a revolution in the automotive and energy sectors. Behind this monumental transformation, key equipments such as Tesla bonding machinery, wire bonding machinery, Tesla battery aluminum wire machinery, … Soma zaidi
Chinese company-Dongguan Dongxin Electronic Technology Co., Ltd. iko katika Dalang Town, Mji wa Dongguan, Mkoa wa Guangdong. After years of precipitation, (the company successfully applied for ISO9001 quality management system certification) (trademark certification) (patent) the company has become a collection of R&D, production, and sales. A modern high-tech enterprise. The products produced by the company include … Soma zaidi
It is used in the bonding of semiconductor devices, such as TO-252, TO263, TO247，TO-3p IGBT,etc.packages.It is also widely used to bond high and medium Power Transistor, Thyristor,FET, High Current Fast Recovery Diode, Schottky. Multi-row products such as Polar Tubes. Equipped with the optional wire pull tester, non-destructive online pull test can be done to ensure bonding … Soma zaidi
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