MGP mold plunger bar and pot set for semiconductor packaging

Products

MGP mold plunger bar and pot set for semiconductor packaging

MGP mold plunger bar and pot set for semiconductor packaging

Product No.:DXMJ-22001 Product Name: Cavity plunger Brand: China DOXO Tolerance range: +-0.002 Pr...

Customized high end MGP mold plunger bar and pot set for semiconductor packaging

Customized high end MGP mold plunger bar and pot set for semiconductor packaging

Product Name: Cavity plunger Brand: China DOXO Tolerance range: +-0.002 Processing customization:...

Original factory cutter blade for aluminum wire bonding machine for semiconductor products pack

Original factory cutter blade for aluminum wire bonding machine for semiconductor products pack

★The product is made of special imported steel ★Forging and quenching for many times to prolong l...

High end low price long life bonding machine consumables FK and KS heavy aluminium wire bonding tool

High end low price long life bonding machine consumables FK and KS heavy aluminium wire bonding tool

★The product is made of special imported steel ★Forging and quenching for many times to prolong l...

Original manufacturer long life bonding machine consumables thick copper wire V groove wedge bonding tool

Original manufacturer long life bonding machine consumables thick copper wire V groove wedge bonding tool

★The product is made of special imported steel ★Forging and quenching for many times to prolong l...

Dongguan manufacturer heavy aluminum or copper wire bonding cutter blade for semiconductor products packaging

Dongguan manufacturer heavy aluminum or copper wire bonding cutter blade for semiconductor products packaging

★The product is made of special imported steel   ★Forging and quenching for many times to pr...

Products

Home
Products
About
Contact

Please leave us a message

    * Name

    *Email

    Phone / WhatsAPP / WeChat

    * What I have to say.