Индустрия оборудования для соединений: Тенденции формируют будущее полупроводниковой упаковки
As global demand for advanced electronics accelerates—from electric vehicles (EVs) to 5G and AI—wire bonding equipment has emerged as a critical component of semiconductor manufacturing. Once considered a mature technology, wire bonding is now evolving rapidly to meet the needs of high-performance, miniaturized devices and advanced packaging techniques. In this article, we examine the key … Читать далее
