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wire bonding machine

The Wire Bonding Equipment Industry: Trends Shaping the Future of Semiconductor Packaging

As global demand for advanced electronics accelerates—from electric vehicles (EVs) to 5G and AI—wire bonding equipment has emerged as a critical component of semiconductor manufacturing. Once considered a mature technology, wire bonding is now evolving rapidly to meet the needs of high-performance, miniaturized devices and advanced packaging techniques. In this article, we examine the keyČitaj više

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