- Dual Bond Head：High Productivity
- Linear Guided Z Bond Head：Reliable and Repeatable Bond Force
- High Speed Contact Sensing：Non-delay Contact Sensing On Bond Level
- Voice-coil Wire Clamp：Proper Wire Feed During Bonding Cycle
- Closed-loop Bond Force Control：Voice-coil Real Time Force Control
S'utilitza en la unió de dispositius semiconductors, com ara TO-252, TO263, TO247，TO-3p IGBT,etc.packages.També s'utilitza àmpliament per unir transistors d'alta i mitjana potència, Tiristor,FET, Díode de recuperació ràpida d'alt corrent, Schottky. Productes multifila com ara Polar Tubes.
Equipat amb el provador de tracció de filferro opcional, non-destructive online pull test can be done to ensure bonding quality.
Efficient And Accurate Vision System
On the fly Vision Capture System：Reduce Machine Vibration Effect on Image Quality.
Ether CAT-A real-time control system
An EtherCAT controlled bonder provides real-time bond force and bond power feedback control lead to high quality bonding.Machines networking can be done easily to support equipment monitoring,remote set up and software update.
