- Dual Bond Head：High Productivity
- Linear Guided Z Bond Head：Reliable and Repeatable Bond Force
- High Speed Contact Sensing：Non-delay Contact Sensing On Bond Level
- Voice-coil Wire Clamp：Proper Wire Feed During Bonding Cycle
- Closed-loop Bond Force Control：Voice-coil Real Time Force Control
Li se itilize nan lyezon nan aparèy semi-conducteurs, tankou TO-252, TO263, TO247，TO-3p IGBT,etc.packages.It se tou lajman itilize kosyon segondè ak mwayen Power Transistor, Tiristor,FET, Segondè aktyèl rapid rekiperasyon Dyòd, Schottky. Pwodwi milti-ranje tankou tib polè.
Ekipe ak tèsteur rale fil si ou vle, non-destructive online pull test can be done to ensure bonding quality.
Efficient And Accurate Vision System
On the fly Vision Capture System：Reduce Machine Vibration Effect on Image Quality.
Ether CAT-A real-time control system
An EtherCAT controlled bonder provides real-time bond force and bond power feedback control lead to high quality bonding.Machines networking can be done easily to support equipment monitoring,remote set up and software update.
