As global demand for advanced electronics accelerates—from electric vehicles (EVs) to 5G and AI—wire bonding equipment has emerged as a critical component of semiconductor manufacturing. Once considered a mature technology, wire bonding is now evolving rapidly to meet the needs of high-performance, miniaturized devices and advanced packaging techniques. In this article, we examine the key … Опширније
Amidst the rapid development of global technology and manufacturing, Tesla stands out like a brilliant star. With its exceptional innovation capabilities and leading technological prowess, it has ignited a revolution in the automotive and energy sectors. Behind this monumental transformation, key equipments such as Tesla bonding machinery, wire bonding machinery, Tesla battery aluminum wire machinery, … Опширније
Chinese company-Dongguan Dongxin Electronic Technology Co., доо. се налази у месту Даланг Товн, Донггуан Цити, Гуангдонг Провинце. After years of precipitation, (the company successfully applied for ISO9001 quality management system certification) (Сертификација за заштитни знак) (patent) the company has become a collection of R&Д, production, and sales. A modern high-tech enterprise. The products produced by the company include … Опширније
It is used in the bonding of semiconductor devices, such as TO-252, TO263, TO247，TO-3p IGBT,etc.packages.It is also widely used to bond high and medium Power Transistor, Thyristor,FET, High Current Fast Recovery Diode, Schottky. Multi-row products such as Polar Tubes. Equipped with the optional wire pull tester, non-destructive online pull test can be done to ensure bonding … Опширније
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