- Dual Bond Head：High Productivity
- Linear Guided Z Bond Head：Reliable and Repeatable Bond Force
- High Speed Contact Sensing：Non-delay Contact Sensing On Bond Level
- Voice-coil Wire Clamp：Proper Wire Feed During Bonding Cycle
- Closed-loop Bond Force Control：Voice-coil Real Time Force Control
It is used in the bonding of semiconductor devices, such as TO-252, TO263, TO247，TO-3p IGBT,etc.packages.It is also widely used to bond high and medium Power Transistor, Thyristor,FET, High Current Fast Recovery Diode, Schottky. Multi-row products such as Polar Tubes.
Equipped with the optional wire pull tester, non-destructive online pull test can be done to ensure bonding quality.
Efficient And Accurate Vision System
On the fly Vision Capture System：Reduce Machine Vibration Effect on Image Quality.
Ether CAT-A real-time control system
An EtherCAT controlled bonder provides real-time bond force and bond power feedback control lead to high quality bonding.Machines networking can be done easily to support equipment monitoring,remote set up and software update.
